Substrate processing method
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United States of America Patent
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Apr 12, 2005
Grant Date -
Mar 27, 2003
app pub date -
Sep 27, 2002
filing date -
Sep 27, 2001
priority date (Note) -
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status (Latency Note)
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Abstract
A specific amount of a processing solution is supplied on a wafer by spraying the processing solution from a first end (tip) of a nozzle. The solution surface of the processing solution remaining in the nozzle is sucked back to a second end side of the nozzle by aspirating the remaining processing solution to the second end side. The first end of the nozzle is then soaked into a fluid. The processing solution remaining in the nozzle is aspirated to the second end side to aspirate a specific amount of the fluid into the first end of the nozzle for further sucking back the solution surface of the processing solution to the second end side, thus the solution surface of the processing solution being not touching the fluid.
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