Methods of forming capacitors

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United States of America Patent

PATENT NO 6878585
SERIAL NO

09943180

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Abstract

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A method of forming a capacitor includes forming first and second capacitor electrodes over a substrate. A capacitor dielectric region is formed intermediate the first and second capacitor electrodes, and includes forming a silicon nitride comprising layer over the first capacitor electrode. A silicon oxide comprising layer is formed over the silicon nitride comprising layer. The silicon oxide comprising layer is exposed to an activated nitrogen species generated from a nitrogen-containing plasma effective to introduce nitrogen into at least an outermost portion of the silicon oxide comprising layer. Silicon nitride is formed therefrom effective to increase a dielectric constant of the dielectric region from what it was prior to said exposing. Capacitors and methods of forming capacitor dielectric layers are also disclosed.

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Patent Owner(s)

Patent OwnerAddress
MICRON TECHNOLOGY INC8000 S FEDERAL WAY P O BOX 6 BOISE ID 83707-0006

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
DeBoer, Scott J Boise, ID 69 1456
Moore, John T Boise, ID 192 4189

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