Stacking structure for semiconductor devices using a folded over flexible substrate and method therefor
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United States of America Patent
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Apr 12, 2005
Grant Date -
N/A
app pub date -
Feb 19, 2003
filing date -
Feb 19, 2003
priority date (Note) -
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Abstract
A semiconductor stacking structure and method of producing the same has a flexible substrate. A plurality of apertures is formed on the flexible substrate. The plurality of apertures may be formed in groups for coupling semiconductor devices to the flexible substrate. A plurality of traces is formed on the flexible substrate for coupling the plurality of apertures together. A first semiconductor device is coupled to a first side of the flexible substrate. A first adhesive layer is placed on a first side of the flexible substrate for coupling the first semiconductor device to the first side of the flexible substrate. A plurality of contacts is coupled to a second side of the flexible substrate. The contacts and the first adhesive layer liquefy and flow into designated apertures when heated to couple the contacts to the first semiconductor device.
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