US Patent No: 6,879,488

Number of patents in Portfolio can not be more than 2000

Radio frequency module

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Importance

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Abstract

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In a compact radio frequency module, a first chip forms a heater element and a second chip forms a device whose operating characteristics vary with temperature change or whose maximum operating temperature is lower than the maximum operating temperature of the first chip. A multilayer substrate has a plurality of dielectric layers and a plurality of conductor layers and mechanically supports the firs chip and the second chip with some of the conductor layers electrically connected with these chips. The module can conduct the heat generated by the first chip throughout the module; guide the heat generated by the first chip from the module's top face side to its bottom face side; and interrupt the heat conduction from the first conductor pattern on which the first chip is placed to the second conductor pattern on which the second chip is placed.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
HITACHI, LTD.TOKYO13737

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Isobe, Atsushi Kodaira, JP 38 385
Okabe, Hiroshi Kokubunji, JP 57 933
Takeda, Eriko Tokyo, JP 12 69
Tanaka, Satoshi Kokubunji, JP 619 4742

Cited Art Landscape

Patent Info (Count) # Cites Year
 
SHARP KABUSHIKI KAISHA (1)
* 6,205,028 Circuit substrate including printed circuit board having heat-shielding portion 22 1998
 
MESC ELECTRONIC SYSTEMS, INC. (1)
* 4,739,448 Microwave multiport multilayered integrated circuit chip carrier 113 1984
 
Micro Mobio Corp. (1)
* 6,633,005 Multilayer RF amplifier module 22 2001
 
MITSUBISHI DENKI KABUSHIKI KAISHA (1)
* 6,657,523 Stacked radio-frequency module 9 2002
* Cited By Examiner

Patent Citation Ranking

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Patent Info (Count) # Cites Year
 
Other [Check patent profile for assignment information] (2)
* 2006/0268,522 Interface module-mounted LSI package 0 2006
* 2008/0192,433 INTERFACE MODULE-MOUNTED LSI PACKAGE 2 2007
 
RENESAS TECHNOLOGY CORP. (2)
* 7,023,706 Semiconductor device and manufacturing the same 8 2002
* 2003/0165,052 Semiconductor device and manufacturing the same 1 2002
 
UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO., LTD. (1)
* 2008/0291,639 COMMUNICATION MODULE PACKAGE ASSEMBLY 4 2007
 
NXP B.V. (1)
* 2005/0250,352 Connector for chip-card 0 2005
 
TELEFONAKTIEBOLAGET L M ERICSSON (PUBL) (1)
* 2008/0174,969 Printed Board Assembly With Improved Heat Dissipation 7 2004
 
RENESAS ELECTRONICS CORPORATION (1)
* 2008/0253,100 ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE SAME 1 2008
 
SAMSUNG ELECTRONICS CO., LTD. (3)
* 7,154,759 Mounting structure for integrated circuit 1 2004
* 8,624,129 Method of attaching a high power surface mount transistor to a printed circuit board 0 2006
* 2007/0158,102 Method of attaching a high power surface mount transistor to a printed circuit board 0 2006
 
KABUSHIKI KAISHA TOSHIBA (2)
* 7,330,352 Interface module-mounted LSI package 2 2006
7,554,806 Interface module-mounted LSI package 0 2007
 
FUJITSU LIMITED (2)
* 7,436,679 Radio-frequency module for communication 14 2005
* 2006/0202,312 Radio-frequency module for communication and method of manufacturing the same 5 2005
 
TAIYO YUDEN CO., LTD. (6)
* 9,099,979 High-frequency circuit module 0 2013
* 2014/0055,956 High-Frequency Circuit Module 3 2013
9,166,765 High-frequency circuit module 0 2013
* 8,830,010 High frequency circuit module with a filter in a core layer of a circuit substrate 1 2013
* 9,252,739 Module substrate and module 0 2013
8,872,600 High frequency circuit module with a filter disposed in a core layer of a circuit substrate 1 2014
 
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (2)
* 7,106,150 Surface acoustic wave filter 0 2004
* 2005/0062,559 Surface acoustic wave filter 1 2004
 
KYOCERA CORPORATION (2)
* 7,289,008 High-frequency module and communication apparatus 29 2004
* 2005/0104,685 High-frequency module and communication apparatus 23 2004
* Cited By Examiner

Maintenance Fees

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11.5 Year Payment $7400.00 $3700.00 $1850.00 Oct 12, 2016
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