Radio frequency module

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6879488
APP PUB NO 20030128522A1
SERIAL NO

10302813

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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In a compact radio frequency module, a first chip forms a heater element and a second chip forms a device whose operating characteristics vary with temperature change or whose maximum operating temperature is lower than the maximum operating temperature of the first chip. A multilayer substrate has a plurality of dielectric layers and a plurality of conductor layers and mechanically supports the firs chip and the second chip with some of the conductor layers electrically connected with these chips. The module can conduct the heat generated by the first chip throughout the module; guide the heat generated by the first chip from the module's top face side to its bottom face side; and interrupt the heat conduction from the first conductor pattern on which the first chip is placed to the second conductor pattern on which the second chip is placed.

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First Claim

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Patent Owner(s)

Patent OwnerAddressTotal Patents
HITACHI, LTD.TOKYO14027

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Isobe, Atsushi Kodaira, JP 40 445
Okabe, Hiroshi Kokubunji, JP 58 1068
Takeda, Eriko Tokyo, JP 12 86
Tanaka, Satoshi Kokubunji, JP 644 5365

Cited Art Landscape

Patent Info (Count) # Cites Year
 
SHARP KABUSHIKI KAISHA (1)
* 6205028 Circuit substrate including printed circuit board having heat-shielding portion 26 1998
 
MESC ELECTRONIC SYSTEMS, INC. (1)
* 4739448 Microwave multiport multilayered integrated circuit chip carrier 120 1984
 
MICRO MOBIO CORPORATION (1)
* 6633005 Multilayer RF amplifier module 22 2001
 
MITSUBISHI DENKI KABUSHIKI KAISHA (1)
* 6657523 Stacked radio-frequency module 11 2002
* Cited By Examiner

Patent Citation Ranking

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Patent Info (Count) # Cites Year
 
Other [Check patent profile for assignment information] (3)
* 2006/0268,522 Interface module-mounted LSI package 0 2006
* 2008/0192,433 INTERFACE MODULE-MOUNTED LSI PACKAGE 2 2007
* D776664 Smart card 0 2015
 
UNIVERSAL SCIENTIFIC INDUSTRIAL CO., LTD. (1)
* 2008/0291,639 COMMUNICATION MODULE PACKAGE ASSEMBLY 4 2007
 
TELEFONAKTIEBOLAGET L M ERICSSON (PUBL) (1)
* 2008/0174,969 Printed Board Assembly With Improved Heat Dissipation 7 2004
 
SAMSUNG ELECTRONICS CO., LTD. (2)
* 8624129 Method of attaching a high power surface mount transistor to a printed circuit board 0 2006
* 2007/0158,102 Method of attaching a high power surface mount transistor to a printed circuit board 0 2006
 
FUJITSU LIMITED (4)
* 7436679 Radio-frequency module for communication 15 2005
* 2006/0202,312 Radio-frequency module for communication and method of manufacturing the same 5 2005
* 9496248 Interposer for integrated circuit chip package 0 2014
* 2015/0194,413 INTERPOSER FOR INTEGRATED CIRCUIT CHIP PACKAGE 0 2014
 
S-PRINTING SOLUTION CO., LTD. (1)
* 7154759 Mounting structure for integrated circuit 1 2004
 
TAIYO YUDEN CO., LTD. (6)
* 9099979 High-frequency circuit module 0 2013
* 2014/0055,956 High-Frequency Circuit Module 5 2013
9166765 High-frequency circuit module 0 2013
* 8830010 High frequency circuit module with a filter in a core layer of a circuit substrate 1 2013
* 9252739 Module substrate and module 0 2013
8872600 High frequency circuit module with a filter disposed in a core layer of a circuit substrate 1 2014
 
KYOCERA CORPORATION (2)
* 7289008 High-frequency module and communication apparatus 29 2004
* 2005/0104,685 High-frequency module and communication apparatus 28 2004
 
RENESAS TECHNOLOGY CORP. (2)
* 7023706 Semiconductor device and manufacturing the same 9 2002
* 2003/0165,052 Semiconductor device and manufacturing the same 1 2002
 
NXP B.V. (1)
* 2005/0250,352 Connector for chip-card 0 2005
 
ROBERT BOSCH GMBH (1)
* 2010/0328,913 METHOD FOR THE PRODUCING AN ELECTRONIC SUBASSEMBLY, AS WELL AS ELECTRONIC SUBASSEMBLY 1 2010
 
NAGRASTAR, LLC (2)
* D780763 Smart card interface 0 2015
* D780184 Smart card interface 0 2015
 
RENESAS ELECTRONICS CORPORATION (1)
* 2008/0253,100 ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE SAME 1 2008
 
KABUSHIKI KAISHA TOSHIBA (2)
* 7330352 Interface module-mounted LSI package 2 2006
7554806 Interface module-mounted LSI package 0 2007
 
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (2)
* 7106150 Surface acoustic wave filter 0 2004
* 2005/0062,559 Surface acoustic wave filter 1 2004
* Cited By Examiner