US Patent No: 6,879,488

Number of patents in Portfolio can not be more than 2000

Radio frequency module

ALSO PUBLISHED AS: 20030128522

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Importance

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Abstract

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In a compact radio frequency module, a first chip forms a heater element and a second chip forms a device whose operating characteristics vary with temperature change or whose maximum operating temperature is lower than the maximum operating temperature of the first chip. A multilayer substrate has a plurality of dielectric layers and a plurality of conductor layers and mechanically supports the firs chip and the second chip with some of the conductor layers electrically connected with these chips. The module can conduct the heat generated by the first chip throughout the module; guide the heat generated by the first chip from the module's top face side to its bottom face side; and interrupt the heat conduction from the first conductor pattern on which the first chip is placed to the second conductor pattern on which the second chip is placed.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
HITACHI, LTD.TOKYO31537

International Classification(s)

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  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Isobe, Atsushi Kodaira, JP 54 302
Okabe, Hiroshi Kyoto, JP 83 677
Takeda, Eriko Tokyo, JP 14 51
Tanaka, Satoshi Kawasaki, JP 886 3465

Cited Art Landscape

Patent Info (Count) # Cites Year
 
MESC ELECTRONIC SYSTEMS, INC. (1)
4,739,448 Microwave multiport multilayered integrated circuit chip carrier 103 1984
 
Micro Mobio Corporation (1)
6,633,005 Multilayer RF amplifier module 20 2001
 
MITSUBISHI DENKI KABUSHIKI KAISHA (1)
6,657,523 Stacked radio-frequency module 8 2002
 
SHARP KABUSHIKI KAISHA (1)
6,205,028 Circuit substrate including printed circuit board having heat-shielding portion 18 1998

Patent Citation Ranking

Forward Cite Landscape

Patent Info (Count) # Cites Year
 
KABUSHIKI KAISHA TOSHIBA (2)
7,330,352 Interface module-mounted LSI package 2 2006
7,554,806 Interface module-mounted LSI package 0 2007
 
SAMSUNG ELECTRONICS CO., LTD. (2)
7,154,759 Mounting structure for integrated circuit 1 2004
8,624,129 Method of attaching a high power surface mount transistor to a printed circuit board 0 2006
 
FUJITSU LIMITED (1)
7,436,679 Radio-frequency module for communication 11 2005
 
KYOCERA CORPORATION (1)
7,289,008 High-frequency module and communication apparatus 25 2004
 
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (1)
7,106,150 Surface acoustic wave filter 0 2004
 
RENESAS TECHNOLOGY CORP. (1)
7,023,706 Semiconductor device and manufacturing the same 8 2002
 
TAIYO YUDEN CO., LTD. (1)
8,830,010 High frequency circuit module with a filter in a core layer of a circuit substrate 0 2013

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11.5 Year Payment $7400.00 $3700.00 $1850.00 Oct 12, 2016
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