Heated and cooled vacuum chamber shield
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United States of America Patent
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Apr 19, 2005
Grant Date -
Aug 15, 2002
app pub date -
Nov 6, 2001
filing date -
Mar 17, 1997
priority date (Note) -
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status (Latency Note)
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Abstract
The invention is directed to an apparatus and method for reducing particulates in a semiconductor processing chamber. The apparatus comprises a shield for lining at portion of the interior of a vacuum processing chamber. The interior of the shield defines a shield passage. A heater element is disposed within the shield passage. A gas inlet is used for providing gases to the interior of the shield passage. The range of temperatures which may be used is wide and generally fitted to the process. For example, the invention may be used to provide a rapid cooldown or bakeout. Once the temperature is chosen, isothermal conditions can be maintained so as to minimize the thermal cycle stress, reducing cracking, peeling, etc.
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