Etching in combination with other processing techniques to facilitate alignment of a die in a system and structures formed thereby
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United States of America Patent
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Apr 19, 2005
Grant Date -
Jul 15, 2004
app pub date -
Jul 29, 2003
filing date -
Jul 29, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Etching in combination with other processing techniques is used to facilitate alignment of an optical die in an optical system. The optical dies are formed on a wafer level and need to be singulated for use in the optical system. The formation of a precise edge from etching allows more accurate alignment of the optical die in the optical system. The other processing techniques include dicing, sawing, cleaving, breaking and thinning.
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