Method of forming a dual-interface IC card and a card formed of such a method
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United States of America Patent
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Apr 19, 2005
Grant Date -
Jan 2, 2003
app pub date -
Jan 15, 2002
filing date -
Jan 18, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
There is disclosed a method of forming a card embedded with an integrated circuit (IC) and an antenna coil, which method including the steps of (a) embedding an antenna coil onto a core sheet; (b) laminating the core sheet with a number of outer sheets to form a laminated panel; (c) forming a first cavity in the laminated panel to expose part of the antenna coil; (d) pulling out two ends of the antenna coil from the core sheet; and (e) securing the integrated circuit with the antenna coil, e.g. by soldering or thermo compression bonding.
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