Thermally enhanced metal capped BGA package
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United States of America Patent
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Apr 19, 2005
Grant Date -
N/A
app pub date -
Feb 5, 2002
filing date -
Feb 5, 2002
priority date (Note) -
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Abstract
A thermally enhanced wirebond BGA package having a laminate substrate, an IC device mounted on the substrate, and a metal cap defining a cavity inside the package between the IC device and the metal cap. A substantial portion of the cavity is filled with a thermally enhanced epoxy encapsulant establishing a thermal conduction path between the IC device and the metal cap. The BGA package may be further enhanced by bonding a metal heat slug on the laminate substrate and mounting the IC device on the slug.
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