Multiple die interconnect system
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United States of America Patent
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Apr 19, 2005
Grant Date -
Apr 3, 2003
app pub date -
Oct 3, 2001
filing date -
Oct 3, 2001
priority date (Note) -
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Abstract
A multiple integrated circuit (IC) die assembly includes a base IC die and secondary IC dice mounted on a surface of the base IC die. A set of protruding contacts formed on the surface of the base IC die and extending beyond the secondary IC dice link the surface of the base IC die to a printed circuit board (PCB) substrate with the secondary IC die residing between the base IC die and the PCB substrate.
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