Method and apparatus for translating detected wafer defect coordinates to reticle coordinates using CAD data
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United States of America Patent
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Apr 19, 2005
Grant Date -
Jun 24, 2004
app pub date -
Dec 19, 2002
filing date -
Dec 19, 2002
priority date (Note) -
In Force
status (Latency Note)
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Abstract
Systems and methods are described for translating detected wafer defect coordinates to reticle coordinates using CAD data. A wafer inspection image is provided and coordinates of potential defects in the wafer are determined. Then the wafer inspection image is converted into a predetermined image format. CAD data for the device under test is then used to produce a second image, also in the predetermined image format. The CAD-derived image and the wafer-derived image are then aligned, and the coordinates of potential defects in the wafer are converted into CAD coordinates. The CAD coordinates are then used to navigate through the reticle for the wafer in order to locate reticle defects corresponding to the detected wafer defects.
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