Coating film forming method and apparatus
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United States of America Patent
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Apr 26, 2005
Grant Date -
Oct 17, 2002
app pub date -
Apr 16, 2002
filing date -
Apr 16, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A coating solution is sprayed on a rotating wafer held horizontally from a nozzle provided above the wafer while the nozzle is travelling over the wafer from a wafer center to a wafer outer area, thus spirally spraying the coating solution on the wafer. The nozzle stops when the coating solution has reached the wafer outer area and the coating solution is sprayed in circle on the wafer outer area while the wafer is rotating. A coating solution including a component of a coating film and a solvent may be sprayed on a first area to be coated of the wafer and the coating solution and a solvent for the coating film may be sprayed on a second edge area located outside the first area of the wafer.
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