Devices, compositions, and methods incorporating adhesives whose performance is enhanced by organophilic clay constituents
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United States of America Patent
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Apr 26, 2005
Grant Date -
May 29, 2003
app pub date -
Jun 29, 2001
filing date -
Jun 29, 2001
priority date (Note) -
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Abstract
Incorporating organophilic clay into hot melt adhesive compositions, particularly those comprising semi-crystalline, thermoplastic polymers, greatly improves the adhesive properties in many respects. Some of these improvements are particularly beneficial to the specific use of hot melt adhesives filled with electrically conductive particles for use as electrically conductive adhesives.
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