Wafer level burn-in using light as the stimulating signal
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United States of America Patent
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Apr 26, 2005
Grant Date -
N/A
app pub date -
Mar 16, 2000
filing date -
Mar 16, 2000
priority date (Note) -
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Abstract
An apparatus comprises multiple light sources that are applied to specific locations on the surface of a wafer for the purpose of causing a component on a die to respond as if a digital signal had been applied to the component. The multiple light sources may comprise several thousand point light sources such as the individual fibers of a fiber optic bundle. The light is controlled in such a manner to stimulate operation of the electronic circuit for the purpose of burning in the circuit.
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