Void filling device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 6887060
APP PUB NO 20030003174A1
SERIAL NO

10180471

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A void filling device which facilitates insertion of a void filling material into a tubular component and hold of the void filling material therewithin. The device comprises a holder for void filling material which is designed to retain the void filling material to fill a void space by expanding with heat and is of a different material from the void filling material so as to be elastically deformed and inserted into the void space. When the cross-sectional configuration of the void space of the tubular component is a rectangle, the holder is formed into a plate-like configuration which is longer than the diagonal line of the rectangle and is adapted to be insertable into the void space by bending the same arcuately.

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Patent Owner(s)

Patent OwnerAddress
IIDA INDUSTRY CO LTDTOKYO TOKYO METROPOLIS

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Miura, Kenichi Inazawa, JP 9 117
Yamada, Akira Inazawa, JP 373 5387

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