Microstructure devices, methods of forming a microstructure device and a method of forming a MEMS device
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United States of America Patent
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May 3, 2005
Grant Date -
Nov 7, 2002
app pub date -
May 7, 2001
filing date -
May 7, 2001
priority date (Note) -
Expired
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Abstract
Microstructure devices, methods of forming a microstructure device and a method of forming a MEMS device are described. According to one aspect, a microstructure device includes: a semiconductive substrate; a monolithic microstructure device feature coupled with the semiconductive substrate, and wherein at least a portion of the microstructure device feature is configured to move relative to the semiconductive substrate; and a conductive structure provided directly upon the microstructure device feature.
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