Semiconductor package having light sensitive chips
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United States of America Patent
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May 3, 2005
Grant Date -
Jul 24, 2003
app pub date -
Jan 15, 2003
filing date -
Feb 18, 1997
priority date (Note) -
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status (Latency Note)
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Abstract
A microelectronic package including an optoelectronic element having a front face including contacts and a rear surface; flexible conductive leads having first ends connected to the contacts and second ends connected to conductive pads adjacent the optoelectronic element; and an at least partially transparent encapsulant covering the optoelectronic element, the flexible leads and the conductive pads, the conductive pads being exposed on a bottom surface of the encapsulant, the bottom surface of the encapsulant defining a bottom of the package, wherein the encapsulant at the bottom of the package extends between the conductive pads.
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