Polynorbornene foam insulation for integrated circuits
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United States of America Patent
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May 10, 2005
Issued Date -
N/A
app pub date -
Feb 22, 2000
filing date -
Feb 22, 2000
priority date (Note) -
Expired
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Abstract
Methods of providing foamed polynorbornene insulating material for use with an integrated circuit device, as well as apparatus and systems making use of such foamed polynorbornene insulating materials. The methods include forming a layer of polynorbornene material and converting at least a portion of the layer of polynorbornene material to a foamed polynorbornene material, such as by exposing the layer of polynorbornene material to a supercritical fluid. The foamed polynorbornene material can provide electrical insulation between conductive layers of the integrated circuit device.
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