Semiconductor device having a multilayer wiring structure and pad electrodes protected from corrosion, and method for fabricating the same
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United States of America Patent
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May 10, 2005
Grant Date -
Mar 20, 2003
app pub date -
Oct 28, 2002
filing date -
Jan 12, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention provides a semiconductor device which can prevent the oxidization of the surfaces of pad electrodes to enhance the connecting strength between the pad electrodes and external terminals. The semiconductor device according to the present invention comprises pad electrodes for use in connecting external electrodes and a multilayer wiring structure connected to the pad electrodes, wherein one surface of an insulating layer covering the pad electrodes and having openings over the pad electrodes for exposing the surfaces of the pad electrodes is in contact with a metal layer formed from one selected from precious metals and alloys containing the precious metals as main components.
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