Microelectronic packages having an array of resilient leads
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United States of America Patent
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May 10, 2005
Grant Date -
Sep 18, 2003
app pub date -
Apr 7, 2003
filing date -
Sep 29, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A connection component including a flexible substrate having a top surface and a bottom surface, a layer of a compliant, dielectric material overlying the top surface of the substrate, the compliant material layer having a top surface remote from the substrate, an array of flexible, conductive leads having first ends attached to terminals accessible at the bottom surface of the substrate and second ends adjacent the top surface of the compliant layer, wherein each lead comprises a core of a first conductive material surrounded by a layer of a second conductive material, the second conductive material having a greater yield strength than the first conductive material.
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