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Abstract

A system which performs multi-functions including reducing the thickness of oxides on contact pads and probing, testing, burn-in, repairing, programming and binning of integrated circuits. The system includes: at least one module having a holding fixture, a wafer, a probing device, an electronic circuit board, and a temperature control device. There are a number of integrated circuits on the wafer, and the probing device simultaneously contacts substantially all of the electrical contacts in the integrated circuits. There is a plurality of active switching circuits on the probing device. The module may also have a gas source for supplying non-oxidizing gases such as nitrogen and hydrogen into the chamber, a handler for moving the wafers and the probing devices, and a computer coupled to the chamber for controlling and communicating with the handler, the temperature control devices, the holding fixtures and the probing devices. The holding fixture holds a wafer having integrated circuits and aligns the wafer to a probing device. The temperature control device is used to heat the wafer during an oxide reduction process or during burn-in of the wafer. During an oxide reduction process, hydrogen is introduced into the chamber, and the wafer is heated so that the oxides on the contact pads can combine with hydrogen to form water vapor, thus reducing the thickness of the oxides. The computer analyzes the test and/or burn-in data and provides control signals for repairing or programming the integrated circuits. The computer system also generates a database that contains the performance data of all the integrated circuits on the wafer that are tested and allows for immediate feedback of the quality of the integrated circuits.

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First Claim