Increasing thermal conductivity of thermal interface using carbon nanotubes and CVD
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United States of America Patent
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May 10, 2005
Grant Date -
Dec 18, 2003
app pub date -
Jun 12, 2002
filing date -
Jun 12, 2002
priority date (Note) -
Expired
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Abstract
The invention relates to a structure of and a process of forming an integrated circuit package that utilizes a thermal interface material layer having an aligned array of carbon nanotubes affixed to a surface of the layer. The thermal interface material is diamond deposited by chemical vapor deposition. The carbon nanotubes are formed by a plasma discharge process on the surface of the CVDD and also may be formed on the surface of the die.
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