Memory module
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United States of America Patent
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May 10, 2005
Grant Date -
Mar 13, 2003
app pub date -
Jul 16, 2002
filing date -
Sep 10, 2001
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A memory module preferably includes a printed circuit board (PCB) panel having multiple memory chip pad groups arranged on both sides thereof. Each memory chip pad group preferably includes multiple pads that correspond to lead lines of multiple memory chips arranged on the PCB panel. Connectors are preferably formed along an edge of the PCB panel to electrically connect the memory chip pad groups to an external device. Multiple damping chip pad groups preferably include built-in damping chips. One or more of the damping chip pad groups are preferably arranged adjacent to a lateral edge of one or more of the memory chips. The damping chip pad groups can electrically connect the connectors to the memory chip pad groups and dampen the signal noises.
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