Circuit housing
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
May 10, 2005
Grant Date -
Jan 9, 2003
app pub date -
Nov 13, 2001
filing date -
Jun 28, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Miniaturized circuit housing to encapsulate and provide external contacts for at least one integrated circuit, in particular of the flip-chip or wafer-level-package type, with a housing floor, the lower surface of which bears housing contact elements for making external contact and the upper surface of which is electrically connected to circuit contact elements on the lower surface of the circuit, wherein a housing lid is provided, in particular opposite the housing floor, which presses the circuit with the circuit contact element resiliently against the upper surface of the housing floor, and between the circuit contact elements and the housing floor there is no connection that fixes their materials permanently together.
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