Injection mold machine with reduced mold change downtime
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United States of America Patent
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May 17, 2005
Grant Date -
May 27, 2004
app pub date -
Nov 25, 2002
filing date -
Nov 25, 2002
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A die preparation and exchange method wherein dies to be inserted into an injection molding machine are electrically and fluidly heated prior to insertion so as to prepare the dies to make parts more quickly. The die exchange sequence wherein a first set of dies are removed from the machine and are replaced by a second set of dies has been changed from a generally serial sequence to a sequence wherein most steps are performed in parallel or simultaneously, greatly reducing the downtime associated with mold change.
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