Stereolithographic methods of fabricating semiconductor devices having protective layers thereon through which contact pads are exposed
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United States of America Patent
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May 17, 2005
Issued Date -
N/A
app pub date -
Dec 11, 2002
filing date -
Jun 8, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method for forming packaged substrates, including flip-chip dice individually or in a multi-die wafer. The method includes using a stereolithographic process to form a protective dielectric polymeric sealing structure on at least the active surface of the substrate. In addition, the invention encompasses forming a similar layer on a second substrate to be joined to the first substrate. Contact pads of the second substrate are exposed through the layer thereon to facilitate joining of the two substrates. Semiconductor devices formed by the method are also disclosed.
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