Process for producing microelectromechanical components and a housed microelectromechanical component
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United States of America Patent
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May 17, 2005
Grant Date -
Oct 28, 2004
app pub date -
Aug 26, 2002
filing date -
Aug 24, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A microelectromechanical component is produced from a substrate having a first side and a second side which is substantially opposite from the first side, at least the first side having at least one microelectromechanical element, by introducing at least one conductive passage is introduced into the substrate, connecting the first side to the second side.
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