Apparatus and method for determining electrical properties of a semiconductor wafer
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United States of America Patent
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May 17, 2005
Grant Date -
Nov 13, 2003
app pub date -
Apr 11, 2002
filing date -
Apr 11, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An apparatus for measuring an electrical property of a semiconductor wafer includes a probe having an electrically conductive tip formed at least in part of a material that is transparent to light and a probe guard disposed adjacent the electrically conductive tip. The apparatus includes a device for selectively applying a first electrical stimulus between a semiconductor wafer and the electrically conductive tip of each probe when it is positioned in spaced relation to the semiconducting material forming the semiconductor wafer, and a device for selectively applying a second electrical stimulus between the semiconductor wafer and the probe guard of each probe. A device for measuring a response of the semiconductor wafer to the electrical stimuli and for determining from the response at least one electrical property thereof is provided. A light source can be positioned to selectively emit light through the transparent material toward the semiconductor wafer.
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