Method of making a compliant integrated circuit package
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United States of America Patent
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May 24, 2005
Grant Date -
Nov 6, 2003
app pub date -
May 7, 2003
filing date -
Dec 29, 1994
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A component incorporating a dielectric element such as a polymeric film with leads and terminals thereon is assembled with a semiconductor chip and bond regions of the leads are connected to contacts of the chip. At least one lead incorporates a plural set of connecting regions connecting the bond region of that lead to a plurality of terminals. One or more of the connecting regions in each such plural set are severed so as to leave less than all of the terminals associated with each such plural set connected to the contacts of the chip.
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