Frame for semiconductor package
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United States of America Patent
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May 24, 2005
Grant Date -
May 29, 2003
app pub date -
Jan 13, 2003
filing date -
May 9, 2000
priority date (Note) -
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status (Latency Note)
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Abstract
A frame for a semiconductor package has die-pads supported with suspending leads of individual lead frames. Semiconductor devices are arranged on the die-pads. These semiconductor devices are collectively molded with molding compound, and then the collectively molded semiconductor packages are cut into individual packages by means of a dicing saw. In the frame, suspending leads are formed into fish tails, wherein at least one of a longitudinal grid-lead and a transverse grid-lead is eliminated within areas enclosed with fish tails of the suspending leads. Accordingly, whether an R-shape generated by producing the frame by etching is large or small, the existence of metal pieces at the edges of the semiconductor packages is substantially prevented.
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