Method of making wireless semiconductor device, and leadframe used therefor
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United States of America Patent
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May 24, 2005
Grant Date -
Feb 7, 2002
app pub date -
Jul 31, 2001
filing date -
Jul 31, 2000
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A method of making a semiconductor device is provided. The method includes the following steps. First, a semiconductor chip is mounted on a lower conductor, with first solder material applied between the chip and the lower conductor. Then, an upper conductor is placed on the chip, with second solder material applied between the chip and the upper conductor. Then, the first and the second solder materials are heated up beyond their respective melting points. Finally, the first and the second solder materials are allowed to cool down, so that the first solder material solidifies earlier than the second solder material.
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