Apparatus for automatically positioning electronic dice within component packages
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United States of America Patent
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May 31, 2005
Issued Date -
N/A
app pub date -
Dec 5, 2002
filing date -
Apr 18, 1994
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method and apparatus of assembling and disassembling semiconductor dice to be tested from the components of a temporary test package. A computer-controlled vision system is employed to align the dice with the temporary test package bases, and an automated robot arm system is employed to retrieve and assemble the dice with the various package components. The invention has particular utility in the burn-in and other pre-packaging testing of dice to establish known good dice (KGD).
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