Direct attach chip scale package
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United States of America Patent
Stats
-
May 31, 2005
Grant Date -
Dec 6, 2001
app pub date -
Feb 22, 2001
filing date -
Mar 16, 2000
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A reliable, chip scale or flip chip semiconductor device which can be directly attached to a PC board without the use of an underfill material to absorb stress on the solder joints interconnecting the device and board is provided by a silicon chip, having the substrate thinned until the chip thickness is in the range of 50 to 250 microns, attaching a backing or cap layer with specific thermal properties to approximate those of a printed circuit board (PCB), and providing solder bump contacts attached to the input/output terminals.
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