High frequency RF interconnect for semiconductor automatic test equipment
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United States of America Patent
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May 31, 2005
Grant Date -
N/A
app pub date -
Sep 23, 2003
filing date -
Sep 23, 2003
priority date (Note) -
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status (Latency Note)
Importance
Abstract
A RF test interconnection system for connecting a measurement device to a device under test includes, a probe card having a probe extending from a first side of the card for making electrical contact with the device under test and a coaxial connector extending from a second side of the card, a test head having a test head coaxial connector that will mate with the probe card coaxial connector when the probe card and the test head are urged together, and a de-mating device attached to either the probe card or the test head for urging the probe card and the test head apart by applying a separating force therebetween. The probe card and the test card coaxial connectors are electrically connected when the test head and the probe card are urged together by a connection force and electrically disconnected when the connection force is removed.
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