Flexible membrane probe and method of use thereof
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United States of America Patent
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May 31, 2005
Grant Date -
Dec 16, 2004
app pub date -
Jun 13, 2003
filing date -
Jun 13, 2003
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A measuring apparatus for measuring a semiconductor wafer, or a film or coating thereon, includes an electrically conductive wafer chuck and a probe having a probe body defining an internal cavity in fluid communication with an electrically conductive and elastic or resilient membrane. The membrane and a topside of the semiconductor wafer are moved into spaced relation when the semiconductor wafer is supported by the wafer chuck. A pressure of fluid supplied to the internal cavity of the probe body is selectively controlled whereupon the membrane expands into contact with the topside of the semiconductor wafer. A suitable test stimulus is applied to the membrane and the semiconductor wafer and the response of the semiconductor wafer to the test stimulus is measured.
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