Soldering method and solder joint member
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United States of America Patent
Stats
-
Jun 7, 2005
Grant Date -
Sep 11, 2003
app pub date -
Jan 10, 2003
filing date -
Jan 11, 2002
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
In a soldering method for soldering an electronic component including a palladium or palladium alloy layer formed on a surface of the electronic component and also including a soldering lead terminal onto a printed wiring board including a soldering land and plated through hole, a solder layer containing tin and zinc as main components is formed on the surfaces of the land through hole by a HAL treatment. The lead terminal is inserted and mounted in the through hole. The printed wiring board is brought into contact with jet flows of a solder containing tin and zinc as the main components to thereby supply a solder to the land and through hole.
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