Microlithography reduction objective and projection exposure apparatus
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United States of America Patent
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-
Jun 7, 2005
Issued Date -
N/A
app pub date -
Jun 25, 2003
filing date -
Feb 15, 1999
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A projection objective formed from six mirrors arranged in a light path between an object plane and an image plane is provided. The projection objective, in some examples, is characterized by having a physical distance between the vertexes of adjacent mirrors that is large enough to allow for the six mirrors to have sufficient thickness and stability properties to prevent surface deformations due to high layer tensions. In some embodiments, mirror thickness are such that surface deformations are prevented with mirrors having layer tensions lower than 350 MPa. Mirror surfaces may comprise multilayer systems of Mo/Be or Mo/Si layer pairs. In some examples, the physical distance between a vertex of the third mirror and a vertex of the sixth mirror (S3S6) satisfies the following relationship: 0.3×(a used diameter of the third mirror S3+a used diameter of the sixth mirror S6)
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