Fabrication of microstructures with vacuum-sealed cavity
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United States of America Patent
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Jun 7, 2005
Grant Date -
Nov 27, 2003
app pub date -
May 24, 2002
filing date -
May 24, 2002
priority date (Note) -
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Abstract
A cavity forming formed in an encapsulation structure under a vacuum in a vacuum chamber is sealed with a capping layer. A stiff protective layer under tensile stress is deposited on the capping layer prior to venting the vacuum chamber to atmospheric pressure. The capping layer is preferably aluminum or an aluminum alloy, and the protective layer is preferably δ-TiN having a suitable high Young's modulus.
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