Method of manufacturing printed circuit board and multi-layered PCB
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United States of America Patent
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Jun 7, 2005
Grant Date -
Feb 26, 2004
app pub date -
Aug 30, 2002
filing date -
Aug 21, 2002
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Disclosed is a fabrication method of a printed circuit board, consisting of plating a metal on a pattern-formed metallic substrate to form a conductive metal line; forming a polymer layer as a base substrate over the conductive metal line-formed metallic substrate and drying the formed polymer layer; forming a via hole in the polymer layer, followed by plugging the formed via hole by electroplating; and removing the metallic substrate. The method is advantageous in terms of maximum efficiency of use of the surface area of PCB, and fineness and high integration of circuits because of not requiring an additional etching process.
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