Process for dressing molded array package saw blade

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United States of America Patent

PATENT NO 6903304
SERIAL NO

10660612

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Abstract

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A process for reworking or dressing a saw blade used in wafer dicing and singulation of molded array integrated circuit packages, includes rotating the saw blade on a spindle and ablating an edge portion of the saw blade using a laser and thereby dressing the saw blade.

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Patent Owner(s)

Patent OwnerAddress
UTAC HONG KONG LIMITED28 FUI YIU KOK STREET UNIT E 9/F METEX HOUSE TSUEN WAN N T

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fan, Chun Ho Sham Tseng, HK 60 3459
Lau, John Ping Sheung Wong Tai Sin, HK 1 8
Lin, Geraldine Tsui Yee Tung Tau Est, HK 6 189
McLellan, Neil Danville, CA 85 4588

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