Apparatus, methods and articles of manufacture for packaging an integrated circuit with internal matching
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United States of America Patent
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Jun 7, 2005
Grant Date -
Feb 12, 2004
app pub date -
May 1, 2003
filing date -
May 9, 2002
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An integrated circuit package houses and connects to a die to form an integrated circuit with internal matching. The package comprises a lead frame comprising at least one transmission line, a die paddle, and at least one input lead and at least one output lead. Bond wires connect select locations along the at least one transmission line to ground through impedance matching circuit components located within the integrated circuit to provide an impedance matching network associated with at least one of the output leads. The package may also substantially encapsulate the lead frame, while exposing the die paddle and the input/output leads.
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