Packaging microelectromechanical structures
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United States of America Patent
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Jun 7, 2005
Issued Date -
N/A
app pub date -
Aug 19, 2003
filing date -
Apr 3, 2002
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A microelectromechanical system may be enclosed in a hermetic cavity defined by joined, first and second semiconductor structures. The joined structures may be sealed by a solder sealing ring, which extends completely around the cavity. One of the semiconductor structures may have the system formed thereon and an open area may be formed underneath said system. That open area may be formed from the underside of the structure and may be closed by covering with a suitable film in one embodiment.
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