Integrated, in-line bumping and exposure system
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United States of America Patent
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Jun 7, 2005
Grant Date -
Jan 20, 2005
app pub date -
May 25, 2004
filing date -
May 29, 2003
priority date (Note) -
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Abstract
An integrated, in-line bumping and exposure system for printing plates or other substrates having a photosensitive layer. A linear illumination source or sources are for bumping the photosensitive material with a band of illumination to consume dissolved oxygen within the photosensitive layer. A raster scan optical assembly or an illuminated and re-imaged spatial light modulator array exposes the photosensitive material with a rasterized beam or beams or an array of modulated electromagnetic radiation located downstream of the bumping illumination. A conveyance mechanism is configured to provide relative continuous motion between one or more substrates and the bands of illumination to continuously bump and pattern one portion of the plate or plates while the other portion of the plate or plates is bumped in anticipation of patterning.
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