Pressure sensor and method for manufacturing pressure sensor
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United States of America Patent
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Jun 14, 2005
Grant Date -
Jan 15, 2004
app pub date -
Oct 1, 2001
filing date -
Sep 29, 2000
priority date (Note) -
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Abstract
A cover plate (130) which is a plate member made of sapphire is joined to a pressure sensor chip (110), to which a buffer member (120) is fixed, by using a coating solution prepared by adding titanium dioxide to an aqueous solution of boehmite (AlO(OH)) which is a hydroxymineral of aluminum.
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