Semiconductor device, method for manufacturing an electronic equipment, electronic equipment, and portable information terminal
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 14, 2005
Grant Date -
Feb 5, 2004
app pub date -
Jul 8, 2003
filing date -
Mar 21, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A semiconductor device includes projecting electrodes formed on one surface of a wiring substrate so as to have a prescribed height, a semiconductor chip having a thickness smaller than the height of the projecting electrodes, and an electronic component having a thickness larger than that of the semiconductor chip and mounted on the other surface of the wiring substrate so that the wiring substrate is warped to be recessed at the one surface. Thus, the rigidity as well as the spacing between the semiconductor chip and the mounting board are assured. Moreover, the semiconductor device having a logic LSI mounted on both surfaces of a wiring substrate is mounted on a mounting board in a housing with projecting electrodes having a prescribed height interposed therebetween, wherein the wiring substrate is warped to be recessed on the side having the projecting electrodes.
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