High density, area array probe card apparatus
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Jun 14, 2005
Grant Date -
Jan 24, 2002
app pub date -
Jul 14, 2001
filing date -
Jul 19, 2000
priority date (Note) -
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status (Latency Note)
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Abstract
A probe card apparatus comprising a rigid substrate having thermal expansion characteristics near that of silicon, laminated with a flex film having laser patterned leads and contact pads, and contact elements comprising noble metals protruding from two major surfaces, the first mirroring the closely spaced chip pads, and the second aligned to the more generously spaced probe card pads, providing an accurate and reproducible, low cost, rapidly fabricated probe contact device, capable of contacting very high density bond pads in either area array or perimeter locations, of being electrically optimized, and readily maintained.
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