Electronic component with a semiconductor chip, and method of producing the electronic component
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Jun 14, 2005
Grant Date -
Oct 17, 2002
app pub date -
Apr 2, 2002
filing date -
Apr 2, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The electronic component has a semiconductor chip mounted to a wiring board. The chip is bonded to the wiring board with adhesive strips that leave free a through-cutout, an additional cutout, and separating joints. The additional cutout provides for a plastic reservoir from which the separating joint between the adhesive strips is filled with plastic material.
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