Tailored interconnect module

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United States of America Patent

PATENT NO 6908314
APP PUB NO 20050014397A1
SERIAL NO

10618629

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Abstract

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An integrated circuit interconnect module for reducing interconnections between integrated circuit chips MOUNTED ON a support substrate. At least one primary integrated circuit (IC) device chip and a plurality of interacting peripheral integrated chip devices. The interconnect module including a plurality of interface pins, each integrated circuit device having a plurality of interface ports. At least one interface port of which is connected to another one of said plurality of integrated circuit devices, at least one of said integrated circuit devices having an interface port connected to an interface pin whereby the majority of nodes on the interacting peripheral devices are adapted to interface with nodes of the primary IC devices in such a way as to condense the number of nets so that the total number of nodes connected to external pins is minimized.

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Patent Owner(s)

Patent OwnerAddress
ALCATEL75382 PARIS CÉDEX 08

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Brown, Paul Wakefield, CA 149 1617

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