Method and apparatus for probe tip cleaning and shaping pad
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United States of America Patent
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Jun 21, 2005
Grant Date -
Feb 6, 2003
app pub date -
Aug 2, 2001
filing date -
Aug 2, 2001
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A method and apparatus is provided for cleaning and shaping a probe tip using a multi-layer adhesive and abrasive pad. The multi-layer adhesive and abrasive pad is constructed on the surface of a support structure, such as a silicon wafer, and is made of an adhesive in contact with abrasive particles. Adhesive is applied in layers with abrasive particles in-between each layer of adhesive. Abrasive particles may vary in size and material from layer to layer to achieve cleaning, shaping and polishing objectives.
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