Local dry etching method
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 21, 2005
Grant Date -
Oct 23, 2003
app pub date -
Apr 21, 2003
filing date -
Apr 22, 2002
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
In a local dry etching method, position-thickness data of a semiconductor wafer is previously obtained by measuring the wafer surface, components of position-thickness data shorter than a predetermined spatial wavelength are cut off by filtering and nozzle-wafer relative speed for planarizing the surface is calculated using the filtered data.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully