Multi-chip package (MCP) with a conductive bar and method for manufacturing the same
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United States of America Patent
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-
Jun 21, 2005
Grant Date -
Jun 12, 2003
app pub date -
Nov 27, 2002
filing date -
Dec 6, 2001
priority date (Note) -
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status (Latency Note)
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Abstract
A multi-chip package (MCP) is provided. The MCP comprises a plurality of stacked semiconductor chips, each including a chip pad and a first insulating layer overlying the chip pad with an opening to expose a portion of the chip pad. Each chip additionally includes a pad redistribution line formed on the first insulating layer and a second insulating layer covering the pad redistribution line. A via hole is formed through the chip, the first insulating layer, a pad redistribution line and the second insulating layer. The MCP further includes a protective layer formed on the bottom of the lowest semiconductor chip. The protective layer includes a conductive pad formed opposite the bottom of the lowest semiconductor chip. A conductive bar extends through the via holes of the stacked semiconductor chips, from the conductive pad, and is electrically connected to the pad redistribution line of the stacked semiconductor chips.
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